TI, PowerStack, 3-D, Packaging TI touts 3-D packaging technology

SAN FRANCISCO—Texas Instruments Inc. said Wednesday it has shipped more than 30 million power management devices featuring its PowerStack 3-D packaging technology, which the company says offers performance, thermal, power consumption and board space advantages compared with conventional packaging technologies.   

Matt Romig, analog packaging product manager at TI, said the PowerStack technology is the first 3-D packaging technology to stack high-side vertical mosfets. PowerStack  combines both high-side and low-side mosfets held in place by copper clips and uses a ground potential exposed pad to provide thermal optimization, Romig said.

TI has been shipping power management devices with PowerStack for about a year, Romig said. So far, most of the adoption has been in applications that require very high performance such as telecomm equipment and servers. "This isn't something you are going to see in a cellphone or a tablet," Romig said.


PowerStack's combination of stacking and clipping techniques provide significant benefits over traditional side-by-side discrete mosfets, according to Texas Instruments.

TI, PowerStack, 3-D, Packaging TI touts 3-D packaging technology